Chat OnlineRed Glue Epibond Adhesives
Product Details
Stencil printing SMT red glue epibond adhesives 200ml tube
Brief Introduction for SMT red glue epibond adhesives
Stencil printing Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount technology adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast .
Feature of red glue adhesive
For Printing and Dispensing Applications,Fast Curing and Non-Stringing Formula
Good for High Speed Placement Equipment- High Shear Strength
Available in Industry Standard Sizes; Non-REACH Compliant
Dispense, print and pin transfer application.
High-visibility red or yellow options.
Room temperature stability, 6-month room temperature shelf life.
Non slumping and non stringing.
Screen printable with CUT laser stencils to SMD adhesive guidelines.
Stencil printing SMT surface mount adhesives offer excellent performance for all print and dispensing
Non-slumping and non-stringing.
Room temperature stability.
Dispense, print and pin transfer application.
Consistent dot profile and fact curing.
High-visibility red or yellow options.
Stencil Epibond Surface Mount Adhesives Typical Cure Profile
A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:
Ensure the material is heated to the correct temperature for the specific time.
maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.
Printed Adhesives:
Dispensed Adhesive
Products mPa.s Red Glue
Appearance g/cm3 Red
viscosity mpa 280,000mPa·S (280,000cps)
Density 1:31
Shear Strength 14:6
Cure Temperature 105°C
Cure Speed 120-150s
Treating condition:85℃×85%RH×DC50V×1000hrs.
JIS Z3197 Measured at comb electrode model II (G10)
Thixotropy index 6.8(1rpm/10rpm)
Adhesive Strength 2125C 44N(4.5kgf)0.2mgr twin
Mini-mold tr 45N(4.6kgf)0.3mgr twin
SOP·IC 16P 92N(9.4kgf)0.8mgf single×2
Volume resistance 3.6×1016Ω·cm JIS K6911
Insulation resistance 1.2×1014Ω JIS Z3197
Initial value 1.2×1012Ω
After treating* 3.12/1MHZ JIS K6911
Dielectric constant 0.012/1MHZ JIS K6911
Preservation condition 3℃~10℃ To be strictly kept at 3℃ ~10℃ in refrigerator
Main content Main Epoxy resin and some(adhesive agent,wetting agent and surfactant
Features
1)Much lower temperature curing is aimed at amd is practically possible.
2)Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.
3)stable adhesive strength can be obtained with a variety of SMD.
4)Long-term preservation stability is expected.
5)High heat-resistivity and excellent electric properties are possessed.
6)Usable for screen printing.
Curing condition
Recommended curing condition: Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.
When the higher curing temperature and the longer curing time, the stronger adhesive strength can obtained. We would suggest you to search out an optimum curing condition, for the temperature is different on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.
How to use Red glue adhesive
Adhesive should be preserved in refrigerator (below 5±3℃) to keep on its quality.
Before processing, the adhesive should be taken out from the refrigerator for de-freezing about a few hours until it reaching the room temperature.
The bottom of printing screen should be cleaned timely for good printing shape.
Toluene or ethyl acetate is possible to use for cleaning up this adhesive.
This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.
Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.
