1Kg 0.1mm No-Clean Flux Core Wire Solder Sn96.5Ag3.0Cu0.5

No-clean flux core wire solder 0.1mm to 3.0mm LF-01 Sn96.5Ag3.0Cu0.5 BBIEN LF-01 Sn96.5Ag3.0Cu0.5 no clean flux core solder wire are both a halide-free and halogen type available,not water-soluble,flux cored and solid solder wire,melting point is 217 degree Celsius high
Net weight: 1Kg price at 1000USD.
Product Details
No-clean flux core wire solder 0.1mm~3.0mm LF-01 Sn96.5Ag3.0Cu0.5
Brief Introduction for LF-01 Sn96.5Ag3.0Cu0.5 solder wire
The solder wire LF-01 Sn96.5Ag3.0Cu0.5 is tin based lead free no clean solder wire,it is a new development for automated,robotized and manual high tech soldering.Its very low flux spitting guaranties a minimum of equipment cleaning while increasing the soldering quality.The solder wire flux is based on a halide activated synthetic resin composition,which ensures his good wetting properties.
Soldering Advantage
Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained.All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity.
LF-01 Sn96.5Ag3.0Cu0.5 made 0.1mm~3.0mm no clean soldering wire is recommended for use in any hand soldering application where high flux activity is desired.
It was developed to provide superior wetting performance for hand soldering in the electronics industry.The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes.The use of LF-01 silver solder wire results in an extremely clear post-soldering residue without cleaning.The unique chemistry in Sn96.5Ag3.0Cu0.5 was also designed to reduce spattering common to most core fluxes.Sn96.5Ag3.0Cu0.5 can be used for both leadbearing and lead-free soldering.

Application

The LF-01 Sn96.5Ag3.0Cu0.5 Pb free solder wire is suitable for both manual and machine soldering of electrical and electronic components.The flux residues do not need to be removed.
Sn96.5Ag3.0Cu0.5 lead free no clean solder wire is specifies compliance to the IPC J-STD-004B ROL0 standard.It is ideal for electronic assemblies used in tomotive,Consumer Electronics,Computer and peripherals,Mobile devices and all types of Au household appliance applications.As well as apply to High-precision medical instrumentation.
Application notes
Use a soldering iron tip size and form to suit the operation:
Small tips for soldering large components may prevent the formation of a joint or slow the process down.
Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered.
Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above.A typical solder tip temperature would be between 215°C and 235°C above the liquidus temperature of the alloy.
The ideal temperature to use is depend on how thermally demanding the assembly is.Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right gradefor the application.
Feature of Sn96.5Ag3.0Cu0.5 soldering wire
High temperature anti-oxygen satisfactory soldering joint and favorable fluidity.Solder joints are filled,and firm.Both RA and RMA are made in compliance with IPC J-STD-006 and JIS Z3283 class AA standards.All these solder flux can be dissolved in solvent,featuring a little smoke and very few splatters.
Diameter:above 0.1mm(0.1mm,0.2mm,0.3mm,0.4mm,0.5mm,0.8mm,1.0mm…)
Very fast wetting;Very low flux spatter
Good spread characteristics
Very low levels of fumes
Clear non-tacky residue
Provides good joint appearance
Halogen and Halide Free

Performance Characteristics:
Colorless translucent residues
Improves wetting performance
Excellent solderability and fast wetting to a variety of surface finishes
Eliminates the need and expense of cleaning
Low smoke and odor
Low spattering
Compatible with leaded and lead-free alloys
Classified as ROL0 per J-STD-004
Compliant to Bellcore GR-78
96.5Ag3.0Cu0.5(SAC305)soldering wire is low tendency of spitting,transparent residues and high thermal capacity,it produces very clean solder joints.As there is nearly no spitting,your soldering machine requires less servicing and you will have less shutdown periods.
Availability
Sn96.5Ag3.0Cu0.5 lead free silver soldering wire is available in a wide variety of types and sizes.
1. Flux core type of solder wire and no flux core(solid)type of solder wire
2. No clean type of silver solder wire
3. Halogen-free type of solder wire and haloids type of solder wire.
4. Acid type of solder wire
5. 0.1mm ultrafine solder wire
6. Many sizes of 0.15mm,0.2mm,0.3mm,0.5mm…3.0mm solder wires are all available
Flux core percentage are1.1%,2.2%and 3.3%.
Packing size
The tin solder wire could be classified as reel packing and tube packing type.
Each spool/roll holds the solder wire is 500g;
Each tube can load the solder wire is 13g/piece
Packing:
core solder wire/solid wire
Appearance
Bright alloy appearance
Packing
50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbin；10kg/carton:40kg/carton
Tube packing:13g/tube
Size of 10kg carton:36x18x8cm
Size of 30kg carton:36x18x26cm
Cleaning
LF-01 SAC305 Pb free solder wire’s flux residues are non-corrosive,non-conductive and do not require removal in most applications.IPA will not clean the residues off the surface of the circuit board after the soldering process.
Storage and Shelf Life
The shelf life of LF-01 Sn96.5Ag3.0Cu0.5 no clean solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.
When stored in a dry,non-corrosive environment between 10°C-40°C(50-104°F),the shelf life of wire may be nearly
Flux-cored solder wires alloys have a 1-3 year warranty from the date of manufacture.
Over time,the surface of wire may lose its shine and appear a dull shade of gray.This is a surface phenomenon and is not detrimental to product functionality.
Other information
OEM logo can be discussed with MOQ.
Delivery time:within 7working days after confirming payment if quantity bellowing 10 tons
Production ability:more than 80tons each month for normal diameter above 1.0mm,1kg/spool.
Certificate:SGS,ISO9001:2008;RoHS,REACH
Technical Datasheet
No-clean flux core wire solder LF-01 Sn96.5Ag3.0Cu0.5
Specification Data
Product Type
Solder wire Sn96.5Ag3.0Cu0.5
Material Tin-Silver-Copper alloy
Composition Sn,Ag,Cu
Melt point 217degree
Flux content 1.5%,2.0%,3.0%or no flux
Application Metal soldering,electronics
Density(g/m^3) 8.3
Diameter 0.1mm,0.2mm,0.3mm,0.4mm,0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,1.5mm.2.0mm.3.0mm
Weight 1000g/pcs,500g/reel,250g/roll;100g,50g
Type No clean Pb free solder wire
Certificate SGS
Keyword Tin silver copper lead free solder wire Solder wire;no clean solder Solder
Packing Details
Specification
core solder wire/solid wire
Appearance Bright alloy appearance
Packing 50g,100g,200g,250g,500g 500g,1kg,2kg per reel/bobbion；10kg/carton:30kg/carton
Tube packing:13g/tube
Size of 10kg carton:36x18x8cm
Size of 30kg carton:36x18x26cm
50g/roll：240rools/export carton:G.W-14kg;Size of Carton:36*26*18cm
100g/roll：120rolls/export carton:G.W-13.5kg Size of Carton:36*26*18cm
200g/roll:120rolls/export carton:G.W-26.5kg Size of Carton:36*26*18cm
500g/roll:51/rolls export carton：G.W-27.5kg Size of Carton:36*26*18cm
1kg/roll:40rolls/export carton:G.W-41.5kg Size of Carton:36*26*18cm
Specification and chemistry component
Specification
Sn99-Ag3.0-Cu0.5
Appearance Lucent,no dirt on wire surface
Physical Characteristic Alloy component
Melting point Proposion g/cm3
Rigidity HB
Advantage And Service
0.1mm no-clean flux core wire solder LF-01 Sn96.5Ag3.0Cu0.5
Certificates of compliance,SGS,ISO and COA,MSDS,are available.