Low-pressure encapsulation injection molding machine

LP2501
Size:
Over molding
Weight:
105.000Kgs

$2999.00

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Low-pressure encapsulation injection molding

Low-pressure injection molding method is ideal for small, intricate parts that require precise molding without damage. The "low pressure" technique minimizes stress on the plastic, crucial for delicate features and connections.
The offer to sample before full production is a major plus. It allows you to evaluate part quality, functionality, and minimize financial risk as you only pay for the mold initially.
Before deciding, carefully consider the overall cost, including mold costs, sampling fees, and production costs. Investigate the machine's capabilities, the supplier's reliability, and inquire about lead times.

This low-pressure injection molding machine excels at encapsulating delicate components like connectors and sensors using polyamide hot melt adhesive. The gentle process minimizes stress, ensuring precise molding without damage.
To aid your investment decision, we offer a sampling service. You can obtain physical samples to evaluate the quality, fit, and finish for a modest mold cost. This allows you to assess the machine's suitability for your specific application before committing to a full production run.
Key benefits include precise encapsulation, minimal stress on components, a wide range of applications, and the cost-effectiveness of the sampling service. This machine is ideal for applications requiring high precision and component protection.

encapsulation injection
Desktop Low-Pressure Injection Molding Machine
Features:
Low-pressure injection: Utilizes low-melting-point granular polyamide material and low-pressure injection molding.
Large capacity: 1-liter glue pot with a Teflon-coated interior.
Precise dosing: Active needle valve prevents leakage.
High precision: Servo motor ensures shot weight accuracy within ±0.3 grams.
Versatile: Suitable for encapsulating various sensors, connectors, and circuit boards.
Advantages of Servo-Driven Injection:
Superior performance compared to pneumatic injection systems.
Applications:
Ideal for encapsulating electronic components such as sensors, connectors, and circuit boards.
This desktop machine is designed for precise and efficient encapsulation of small electronic components. Its low-pressure injection system, coupled with a servo motor, ensures accurate dosing and minimizes damage to delicate parts. The machine's versatility and ease of use make it a valuable tool for a wide range of applications.

Over molding

Insert molding
Insert Molding

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