BGA Rework Station Infrared Heating

BGA Rework Station Infrared Heating

Features
1, the machine uses infrared heating devices, infrared welding technology
2, dedicated infrared heating, penetrating power, the device heat evenly
3, It can weld 35-50mm all components without demolition welding fixture.
4, the machine is equipped with 800W preheat sol system, preheat range 240 * 180mm
5, infrared heating without hot air flow, will not affect the surrounding small components, removable welding or repair BGA, SMD, CSP, LGA, QFP, PLCC and BGA ball, eps BGA, SMD. Pin socket (such as CPU socket and GAP insertion)
6, fully able to meet the computer, notebook, electric tour and other BGA demolition welding / rework requirements.

Power： AC220V/110V 50-60Hz
Mode of Heating：Infrared Heating
Total Power: 1000W/220V 1200W/110V
Preheater:800w/220V 1000W/110V
Infrared Lamp: 150W
Temprature: Preheater (60-200℃) nfrared Lamp(200-450℃)
Working bench size: 360*240mm
Preheating Area:240*180mm
Infrared lamp diameter:Φ70mm
Chips size:35-50mm
Packaging size:43*26*42cm
Net weight:11KG