Dispensing SMT Red Glue Epibond Adhesives 30ml Tube

Dispensing SMT red glue epibond adhesives 30ml tube dispensing SMT Epibond Surface Mount Adhesives also called Red viscous gel or resin SMT adhesive,can be removed from a printed circuit board by heating the board to approximately 80C(176F to 185oF).

Product Details
Dispensing SMT red glue epibond adhesives 30ml tube
Description of dispensing epibond adhesives
Dispensing SMT red glueis a kind of single resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the “rarely cutting” bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties. Moreover it is good for environment protection for its safety, no solvent and no smelling.
Feature of dispensing 30ml red glue adhesive
For Dispensing Applications,Fast Curing and Non-Stringing Formula
Good for High Speed Placement Equipment- High Shear Strength
Available in Industry Standard Sizes; Non-REACH Compliant
Dispense, print and pin transfer application.
High-visibility red or yellow options.
Room temperature stability, 6-month room temperature shelf life.
Non slumping and non stringing.
Screen printable with CUT laser stencils to SMD adhesive guidelines.
Dispensing SMT surface mount adhesives offer excellent performance for all print and dispensing
Non-slumping and non-stringing.
Room temperature stability.
Dispense, print and pin transfer application.
Consistent dot profile and fact curing.
High-visibility red or yellow options.
Dispensing Epibond Surface Mount Adhesives Typical Cure Profile
A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:
Ensure the material is heated to the correct temperature for the specific time.
Maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.
Sales/support in every major electronics geographic market
Local and consistent technical support regionally and globally
Consistent product performance globally
1)Much lower temperature curing is aimed at amd is practically possible.
2)Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.
3)stable adhesive strength can be obtained with a variety of SMD.
4)Long-term preservation stability is expected.
5)High heat-resistivity and excellent electric properties are possessed.
6)Usable for screen printing.