Tin-lead solder paste for LED, QFN surface mount or BGA

Solder paste for SMT production

The shipping fee for solder paste is higher than normal product and need to be shipped separately as chemical product.
The price listed is for 10 cans of 0.5Kg solder paste, shipping cost is Not included.
To efficiently and evenly mix the solder paste to a liquid state, a Solder Paste Mixer is recommended.

GY618B SOLDER PASTE
TYPE: GY618B-183℃
LOT: YAC1611002H
ALLOY: Sn62.8Pb36.8Ag0.4
NET: 500g
WESH: 20-38um
Keep Refrigerated: 0-10 ° C
Name: BGA Colored Paste
Model: GY618B
Ingredients: Tin 62.8 Lead 36.8 Silver 0.4
Particles 20-38 microns (4)
Weight 500 g / bottle
Applicable BGA ball and so on
The temperature of 183 ° C
Features Hook tin strong conductive good solder round and bright

GY626B-183℃
ALLOY: Sn62.8Pb37Ag0.2
NET: 500g
WESH: 20-38um
Keep Refrigerated: 0-10 ° C
Name: BGA Colored Paste
Ingredients: Tin 62.8Lead 37AG0.2(6337)
Particles 20-38 microns (4)
Applicable IC QFN placement
The temperature of 183 ° C
Features Hook tin strong conductive good solder

A-888-183℃
LOT: KAC1611005H
ALLOY: Sn63Pb37
WESH: 20-38um
Keep Refrigerated: 0-10 ° C
Name: BGA Colored Paste
Ingredients: Tin 63Lead 37(6337)
Particles 20-38 microns (4) Applicable IC 0.3-0.5 spacing
The temperature of 183 ° C
Features Strong solder joints Strong Tin

GY439-LED-170℃
Ingredients Tin 43 Lead 43 Bismuth 14
Particles: 25-45 microns (3)
Applicable to LED products
The melting point of 170 ° C
Features Low temperature LED does not shift
LOT: KAC 16100501H
ALLOY: sN43Bi14Pb43
Wesh: 25-45um

GY361-LED-190℃
Ingredients Tin 55 Lead 45(5545)
Particles: 25-45 microns (3)
Applicable to LED products
The melting point of 190 ° C
Features Low temperature LED does not shift
Wesh: 25-45um