China LED SMT machine development

2008 LED patch into the lighting and light source products, a simple single LED patch products, do not need high production accuracy, the domestic enterprises see the opportunity to invest in research and development of simple double-headed LED placement machine.
This is the first generation of the initial type of placement machine, such machines do not have visual identification devices, usually do not have a sophisticated servo system, neither a automatically send board and automatic nozzle change function,it only has multi-axis system with not high accuracy. After two years development,the first generation of models with visual centering function, small and medium-sized LED enterprises as one of the entry models into one model.
2010 with the development of LED products, intelligent LED and drive power of the patch, a simple first model has been unable to meet a variety of devices and precision requirements, the second generation of placement machine with visual recognition, The first two also extended to a greater number of automatic transmission and automatic nozzle function and import servo technology XY axis system can also be imported into the second generation placement machine, a simple IC recognition function can also meet the LED power and LED lighting products At the same time, also to small appliances and simple control board extension.
2013 LED placement machine competition more intense from 3-20 million LED placement machine market, by the accumulation of 5 years of technology, domestic placement machine manufacturers began to cooperate with the domestic colleges and universities to develop, while imports chip agents to maintain high-level cooperation, through the mainstream of imported mounter technology learning and reference, the third generation of placement machine with a higher level of improvement, such as device identification and placement optimization, Z axis height for the first time using precision Of the servo technology to meet the different devices and IC thickness detection and supply, the actual high-precision placement, the third generation of the placement machine in the speed and accuracy of the upgrade is more obvious for high-speed, high-precision placement Device of the device. The third-generation placement machine is actually a sophisticated industrial robot, is the machine - electric - light and computer control technology complex. It allows the SMC / SMD components to be quickly and accurately mounted to the pad locations specified on the PCB board by means of suction-displacement-positioning-placement, without damage to components and printed circuit boards. The alignment of the components in the mechanical alignment, laser alignment, visual alignment of the three ways. Mounter from the rack, xyz movement mechanism (ball screw, linear guide, drive motor), placement head, component feeder, PCB bearing mechanism, device alignment detection device, computer control system, the whole The movement is mainly carried out by the xy movement mechanism, through the ball screw transmission power, by the rolling linear guide movement to achieve directional movement, such a transmission form not only its own movement resistance is small, compact, and high motion accuracy to ensure The placement accuracy of each component. The Mounter marks the mark on important components such as mounting spindles, moving / static lenses, suction nozzles, and feeders. Machine vision can automatically determine the coordinates of these Mark center system, the establishment of the placement machine system coordinate system and PCB, placement component coordinate system between the conversion relationship, calculated the precise movement of the placement machine coordinates; The component type of the mounting element, the component number and other parameters to the corresponding position to grasp the nozzle, suction components; static lens in accordance with the visual processing procedures for the absorption of components to identify, identify and alignment; Mounted on a predetermined location on the PCB. This series of component identification, alignment, detection and placement of the action are IPC according to the corresponding instructions to obtain the relevant data after the command control system automatically completed. Modern equipment and control concept, compact structural design, to ensure high efficiency and high precision single or two pieces of product processing requirements
In 2014 the domestic placement machine will enter the market with low-end production demand for imported laminating machine. According to the forecast, the low-end production demand market in 2016 this market should be the world of domestic placement machine.
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For the development of electronic components, PCBs and integrated circuit manufacturing equipment, after 20 years of development, especially after the rapid development in 2003, with SMT supporting front-end industrial equipment, including printed circuit boards, passive components and other electronic parts manufacturing Equipment has been basically achieved localization, has formed a number of well-known private enterprises, has accumulated a number of high technological content, market capacity, application and industrialization prospects of good scientific research. The core technology of the placement machine is fast, high precision.
To meet this condition, the first is to drive the system and need to respond quickly to feedback. There is a motor, control system, servo system. Then there is an optical recognition system.
Of course, to meet the fast and high precision is only the basic conditions of the placement machine, and many other auxiliary classes, such as software system operability, failure when the device self-test function, error correction works. There are maintainability, equipment life. This is a very complete industrial chain, involving software, new materials, electronic control, optical systems and so on. It is important to have these parts of the processing technology, precision to be perfect.